a) Under-bump metallization and micro-bumps fabricated on the VLSI
By A Mystery Man Writer
Micro Bump System for 2nd Generation Silicon Interposer with GPU
Figure 4 from Stacked solder bumping technology for improved
Stevan DJORDJEVIC, Principal Silicon Photonic Engineer
a) Under-bump metallization and micro-bumps fabricated on the VLSI
PDF) Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of
PPT - Flip Chip And Underfills PowerPoint Presentation, free
US7199036B2 - Under-bump metallization layers and electroplated
Electro- and thermomigration in micro bump interconnects for 3D
a) Under-bump metallization and micro-bumps fabricated on the VLSI
Roshanak SHAFIIHA, Staff Engineer, PhD, R&D
Ivan SHUBIN Research profile