Home bonds bumps

Generic hybrid FPA with indium bump bonds [7].

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Emerging fine-pitch bump bonding techniques - ppt video online

Intrinsic efficiency versus incident photon energy in a PSF with 1 mm

Cumulative distribution of the Cramér-Rao lower bound on the

Fabrication of indium bumps for hybrid infrared focal plane array

Christina L. Howe's research works Vanderbilt University, TN (Vander Bilt) and other places

Generic hybrid FPA with indium bump bonds [7].

The Athena X-ray Integral Field Unit: a consolidated design for

Intrinsic efficiency versus incident photon energy in a PSF with 1 mm

Design of High Quantum Efficiency and High Resolution, Si/SiGe

a) Simulated absorption efficiency of the detector versus incident

Hybrid UV Focal Plane Array (FPA), consisting of a back

Progress on AlGaN-based solar-blind ultraviolet photodetectors and